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BackSimulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: merged pull request 'More schematics' (#3) from schematic by Eeschema 5.1.9-73d0e3b20d~88~ubuntu20.04.1 Generated from.
- Top, https://www.quectel.com/UploadImage/Downlad/Quectel_L80-R_Hardware_Design_V1.2.pdf QFN-24, Pitch 1.20.
- HX10-P-SP2 hall effect current transducer.