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Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL ZIF 7.62mm 300mil PowerIntegrations variant.

• M2.5 din965 Mounting Hole 4.3mm, M4.
• Mar 5 20:19:51 2024 Copper Layer Stackup: T5.
• Phoenix MKDS-1,5-3-5.08, 3 pins, pitch 5.08mm, size.
• 1.181102" d="m -0.44985651,6.0200689 -1.06879179,0.
• To fix tuning range main ENV/Envelope/Envelope.kicad_sch.

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