Labels Milestones
Back1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 1x28 2.54mm single row Surface mounted socket strip SMD 1x26 1.00mm single row style1 pin1 left Surface mounted pin header SMD 2x29 1.27mm double row Through hole vertical IDC box header, 2x12, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header, 2x16, 2.00mm pitch, double rows Through hole straight pin header, 2x10, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x22, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled socket strip, 2x12, 2.00mm pitch, double rows Through hole angled pin header, 1x10, 1.00mm pitch, single row Through hole angled socket strip, 2x32, 1.27mm pitch, single row style2 pin1 right Through hole IDC box header THT 2x12 2.00mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x04 5.08mm.
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