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MWSA0518, 5.4mmx5.2mm TDK NLV25, 2.5x2.0x1.8mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv25-ef_en.pdf tdk nlv25 nlcv25 nlfv25 TDK NLV32, 3.2x2.5x2.2mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv32-ef_en.pdf tdk nlv32 nlcv32 nlfv32 Inductor, TDK, SLF6028, 6.0mmx6.0mm (Script generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 1, Wuerth electronics 97730456332 (https://katalog.we-online.com/em/datasheet/97730456332.pdf), generated with kicad-footprint-generator JST ZE series connector, BM10B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.15 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 7, Wuerth electronics 9775066360 (https://katalog.we-online.com/em/datasheet/9775066360.pdf), generated with kicad-footprint-generator Molex MicroClasp side entry Molex MicroClasp Wire-to-Board System, 55935-1530, 15 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm.

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