Labels Milestones
BackA Circular Fiducial, 1.5mm bare copper, 3mm soldermask opening (Level C Circular Fiducial, 1.5mm bare copper, 3mm soldermask opening (Level A Circular Fiducial, 1mm bare copper, 2.25mm soldermask opening (Level A Circular Fiducial, 0.5mm bare copper, 1.5mm soldermask opening (Level C Circular Fiducial, 1mm bare copper, 3mm soldermask opening Circular Fiducial, 0.75mm bare copper, 1.5mm soldermask opening Circular Fiducial, 0.75mm bare copper, 4.5mm soldermask opening Circular Fiducial, 0.5mm bare copper, 1mm soldermask opening (Level B Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A Circular Fiducial, 1mm bare copper, 2.25mm soldermask opening (Level C Circular Fiducial, 0.75mm bare copper, 2mm soldermask opening (Level B Circular Fiducial, 1.5mm bare copper, 4.5mm soldermask opening Circular Fiducial, 0.5mm bare copper, 4.5mm soldermask opening (Level A Circular Fiducial, 1.5mm bare copper, 4.5mm soldermask opening (Level B Circular Fiducial, 0.5mm bare copper, 2.25mm soldermask opening (Level B Circular Fiducial, 0.75mm bare copper, 1.5mm soldermask opening Circular Fiducial, 1.5mm bare copper, 1.5mm soldermask opening Circular Fiducial, 1.5mm bare copper, 4.5mm soldermask opening Circular Fiducial, 1.5mm bare copper, 3mm soldermask opening (Level A Circular Fiducial, 0.5mm bare copper, 2.25mm soldermask opening Circular Fiducial, 1mm bare copper, 2mm soldermask opening (recommended 5-pin SAW filter package based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.141x3.127mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 6 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 506CM.PDF DFN, 14 Pin (http://www.st.com/resource/en/datasheet/lsm6ds3.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-131-02-xxx-DV, 31 Pins per row.
- / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/ TO-252/DPAK.
- Connector, S12B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Mounting Hardware.
- 56x7.6mm^2 drill 1.2mm pad 2.4mm Terminal Block.
- Metal Strip/Wire, Horizontal, pin pitch=10.16mm, 7W, length*width*height=25*9*9mm^3.
- Uses .6mm this means.