3
1
Back

No Lead Package, 1.2x1.8x1.55 mm Body [HTSSOP], with thermal vias in pads, 4 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator connector Molex Picoflex side entry Molex JAE.

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