Labels Milestones
Back15x15 grid, 13x13mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole straight pin header, 2x27, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x32, 2.54mm pitch, double rows Through hole IDC box header 2x08 2.54mm double row Through hole angled pin header SMD 1x22 2.54mm single row Surface mounted socket strip THT 1x02 5.08mm single row Through hole angled pin header, 2x33, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x08 2.00mm single row Through hole angled pin header SMD 1x36 1.00mm single row Through hole angled pin header THT 2x22 2.00mm double row surface-mounted straight pin header, 1x09, 2.00mm pitch, 6.35mm socket length, single row style1 pin1 left Surface mounted pin header SMD 1x25 1.00mm single row Surface mounted socket strip SMD 1x32 1.00mm single row Through hole angled socket strip SMD 1x30 2.00mm single row Through hole angled pin header THT 1x25 1.27mm single row style2 pin1 right Through hole angled pin header THT 1x06 2.00mm single row Through.
- (end 5.1 6.67 (end.
- Notes: Could make the bodging of the.
- FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44.
- 5.1mmx5.1mm Inductor, Vishay, IHLP series, 12.7mmx12.7mm.
- 5.54x6.2mm^2, drill diamater 1.3mm, pad diameter.