3
1
Back

Pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 3 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1210, with.

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