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R29 | 2 | 10k | Resistor | | | C10 | 1 | SW_SPDT | Switch, single pole normally-open illuminated tactile switch 6mm ALPS SKHH right angle 3mm lightpipe dual tower right angle tactile switch with LED, generic D Push button switch, generic, two pins K switch dp3t ON-ON-ON D Switch, single pole double throw, illuminated paddle, http://www.nkkswitches.com/pdf/gwillum.pdf switch single-pole double-throw spdt ON-ON D Screw terminal, single row, 01x03 D 2x5 pin shrouded header 2.54 mm spacing D 3 pin Molex header 2.54 mm spacing D 2 pin Molex connector KK254 Molex header 2.54 mm spacing D Switch, three position, single pole normally-open tactile switch Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000C374.pdf SMD SMT SPST EVQP2 0 4 2 Button_Switch_SMD SW_SPST_EVQQ2 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE7.pdf 0 2 2 Button_Switch_SMD SW_SPST_EVQPE1 Light Touch Switch 0 4 2 Button_Switch_SMD SW_SPST_EVQP7A Light Touch Switch,https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE20.pdf 0 4 2 Button_Switch_SMD SW_SPST_EVQP2 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000C374.pdf SMD SMT SPST EVQPUJ EVQPUA SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose.

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