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9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array.

• 9.92115 1.25333 0 facet normal 0.787396 0.189041.
• 4 2,5mm vertical SMD spring clamp terminal block.
• 9.177819e+01 2.550000e+00 facet normal.
• 2.006468e-001 9.796637e-001 -0.000000e+000 vertex.

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