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Wurth we cair Semi-Shielded High Saturation Power Inductor, SM-PIC0612H, Fixed inductor, SMD, magneticaly shielded, https://neosid.de/import-data/product-pdf/neoFestind_ma_SMs42.pdf Neosid, Inductor, SM-PIC1004H, Fixed inductor, SMD, https://neosid.de/import-data/product-pdf/neoFestind_SMNE95H.pdf Neosid Inductor SMs42 Fixed inductor SMD Neosid, Power Inductor, body 3x3mm, https://www.we-online.com/catalog/en/WE-LQSH#/articles/WE-LQSH-3012 Semi-Shielded High Saturation Power Inductor, Fixed inductor, SMD, magnetically shielded, https://neosid.de/import-data/product-pdf/neoFestind_SMSME3015.pdf Neosid Power Inductor Ms50 SMD Fixed inductor SMD magnetically shielded Inductor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator JST VH PBT series connector, BM09B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 32-lead dip package, row.

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