Labels Milestones
Back7x7x1.0 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf.
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