3
1
Back

Pitch 0.5mm, thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin without exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3471fb.pdf#page=15), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief.

New Pull Request