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Vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://www.onsemi.com/pdf/datasheet/nis5420-d.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1410, with PCB locator, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Fuse SMD 0805 (2012 Metric), square (rectangular) end.

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