Labels Milestones
BackYFF S-XBGA-N5 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch.
- 0.29704 0.923208 facet normal -0.248691 0.968583 0 facet.
- Pot_wh148() { module v_wall(h, l, th=thickness) .
- -9.832457e-01 -1.822821e-01 -1.015564e-03 vertex -9.035159e+01 9.739274e+01 1.656905e+01 facet.