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5569-20A2, example for new mpn: 39-28-x16x, 8 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0430, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector wire 0.75sqmm double-strain-relief Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Halo N6 SO, 16 Pin (https://www.diodes.com/assets/Datasheets/PAM8403.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 56 Pin top tented version (manually modified). For information see: http://www.cypress.com/file/138911/download QFN.

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