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1006 3 pins U-DFN2510-10 package used by Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal pad HTSSOP32: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP.

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