synth_tools

Back

D2PAK-7 TO-263-7 SOT-427 TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/ TO-252/DPAK SMD package, http://rohmfs.rohm.com/en/techdata_basic/ic/package/hrp7_1-e.pdf, http://rohmfs.rohm.com/en/products/databook/datasheet/ic/motor/dc/bd621x-e.pdf SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg SOT, 3 Pin (https://www.jedec.org/system/files/docs/to-236h.pdf variant AB), generated with kicad-footprint-generator Inductor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S10B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-10P-1.25DS, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2108, 10 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 53261-1571 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator connector Hirose FH12 horizontal Hirose FH12, FFC/FPC connector, FH12-35S-0.5SH, 35 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 14-Lead Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin with exposed pad 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0170, 17 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator connector JST PHD series connector, BM05B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105313-xx03, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Wuerth WR-WTB series connector, S13B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size.

New Pull Request

Labels Milestones