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Mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET S1 MOSFET Infineon PLCC, 20 pins, through hole, DF13-13P-1.25DSA, 13 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-4410, 44 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf.

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