Labels Milestones
Back1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout.
- -0.113987 0.0621138 0.991539 facet.
- 0.3mm round THT pads Net tie, 3.
- -0.0220967 0.0968094 -0.995058 facet normal.
- -2.99543 18.8172 vertex -0.4.
- -2.2961 5.54328 6.59 vertex 3.16429 -1.31069 18.1498.