Labels Milestones

Back

Socket 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm.

• Diode SMC (DO-214AB) Handsoldering Diode SMB (DO-214AA) Handsoldering.
• -0.0947152 -0.0292373 0.995075 vertex 7.29364 -3.51243 19.9509 vertex.
• (https://www.diodes.com/assets/Datasheets/PAM2306.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects