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Header (for PCBs); Angled solder pin 1 x 1 mm, 734-178 , 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x24.42mm 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 25.4 mm (1000 mils), Socket.