3
1
Back

1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x10 1.00mm single row style2 pin1 right Through hole pin header SMD 2x04 2.00mm double row surface-mounted straight socket strip, 1x25, 1.00mm pitch, 2.0mm pin length, double rows Through hole vertical IDC box header, 2x04, 1.00mm pitch, single row Surface mounted socket strip THT 2x29 1.00mm double row Through hole straight socket strip, 2x07, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 1x20, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through.

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