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BackHref="https://gitea.circuitlocution.com/synth_mages/MK_SEQ/commit/b77534e3fc83cf3f21d8c938a2ebb93ca539acd3">b77534e3fc83cf3f21d8c938a2ebb93ca539acd3 updated README.md f0ccd475bcae4d90f684767b57611a775351886d Update README.md * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md) How to use your choice of sitching hardware). Consider aesthetics and prcticality of stand-offs from front panel. Possibly do as an edge cut? Corrected in Rev 2.0 alpha 1: Properly assign potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin (JEDEC MO-153 Var GB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0280, 28 Circuits (https://www.molex.com/pdm_docs/sd/2005280280_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 32 Pin (http://infocenter.nordicsemi.com/pdf/nRF52810_PS_v1.1.pdf#page=468), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-132-02-xxx-DV-LC, 32 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-M (7260-20 Metric), IPC_7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1.5 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wire, basic insulation, conductor diameter 0.48mm, outer diameter 2mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0510, with PCB locator, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin, RGY0020A (https://www.ti.com/lit/ds/symlink/txb0108.pdf#page=33 Texas RSE0010A UQFN, 10 Pin (https://www.nxp.com/docs/en/data-sheet/PCF85063A.pdf#page=48), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 7, Wuerth electronics 9775106360 (https://katalog.we-online.com/em/datasheet/9775106360.pdf), generated with kicad-footprint-generator JST PH series connector, B3B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV, 12 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST XH series connector, 502386-1570 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 28 Pin (JEDEC MO-153 Var HD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0014 example for new part number: 22-27-2021, 2 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf.
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