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DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121.

• 43160-0106, With thermal vias in.
• 2 commits » created.
• 2.167737e-001 -9.762219e-001 0.000000e+000 vertex 6.971169e+000.
• 7.987200e+000 9.983999e+000 vertex -4.056728e+000 5.738834e+000 1.747200e+001 facet.

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