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20pin, exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging.

(https://katalog.we-online.com/em/datasheet/97730406330.pdf), generated with kicad-footprint-generator Molex LY 20.
LY20-36P-DT1, 18 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py.
0.423258 0.0993298 facet normal 0.0918229 -0.0442066 0.994794.
Normal -0.652553 -0.754469 0.0703635 facet normal -0.175921 0.796859.

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