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Tab down Shielded RJ45 ethernet magnetic transformer connector horizontal angled 90deg THT male pitch 2.77x2.84mm mounting holes 63.5mm, distance of mounting holes 47.1mm, distance of mounting holes 47.1mm, distance of mounting holes to PCB edge 15.979999999999999mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 25-pin D-Sub connector horizontal angled 90deg THT female pitch 2.77x2.54mm pin-PCB-offset 9.4mm 15-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, female, pitch 2.77x2.54mm, pin-PCB-offset 9.4mm, see http://docs-europe.electrocomponents.com/webdocs/1585/0900766b81585df2.pdf 9-pin D-Sub connector straight vertical THT male pitch 2.29x1.98mm pin-PCB-offset 8.35mm mounting-holes-distance 25mm mounting-hole-offset 25mm 15-pin D-Sub connector horizontal angled 90deg THT male pitch 2.29x1.98mm pin-PCB-offset 3.0300000000000002mm mounting-holes-distance 33.3mm mounting-hole-offset 33.3mm 26-pin D-Sub connector horizontal angled 90deg THT male pitch 2.29x1.98mm mounting holes 33.3mm, distance of mounting holes to PCB edge 9.12mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 62-pin D-Sub connector horizontal angled 90deg THT female pitch 2.29x2.54mm pin-PCB-offset 9.4mm 44-pin D-Sub connector straight rugged MUSB D511 USB 2.0 Type B Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-170 , 10 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 32 leads; body width 4.4 mm; thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small Outline (SM) - 5.28 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [TSSOP] with exposed pad 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [TQFP] With Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (JEDEC MO-153 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-184 , 24 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Hirose.

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