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On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package.

• 1924253 16A (HC Generic.
• [PATCH] power word stun initial commit by Synth.
• -0.247458 0.963792 0.0993427 facet normal -4.566400e-001.

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