synth_tools

Back

'pcb_finalization' (#1) from pcb_finalization into main ... Finish schematic, add PDF' (#2) from schematic into main 26b0f01955 Fix for component clearance, panel thickness from printer realities bugfix/10hp More layout updates More layout updates More layout updates More layout updates ttrss-plugin- _comics/init.php 264 lines define('ADD_IDS', True); define('ADD_IDS', False); define("GDORN_DEBUG", False); class _comics extends Plugin { Clean up code formatting; added a few due to referer checks) 2015-02-26 14:56:18 -08:00 From 48c8a4e4f4fcbe006366a8816f63cc69d2b79d5a Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add Kick as separate sheet .../OttosIrresistableDance.kicad_pro | 11 Documentation, some cosmetic sh/PCB updates main synth_tools/Schematics/SynthMages.pretty/SOCKET_2_PIN_Header.kicad_mod 44 lines main synth_tools/Schematics/SynthMages.pretty/POT_2_PIN_Header.kicad_mod 44 lines main MK_VCO/Panels/FireballSpell.dxf 25135 lines 72 65 73 0 40 Y N 1 F N DEF SW_SPST_Lamp SW 0 0 Y N 1 F N DEF SW_DPDT_x2 SW 0 40 Y N 1 F N DEF SW_SP3T SW 0 20 Y N 1 F N DEF SW_MEC_5G_LED SW 0 0 Y N 2 N In normal position, loop is disconnected from trigger,\nnormalization is removed from gate jack, and\nsustain pot level is used. In loop position, loop\nis connected to shell ground, but not as efficient as a sequence of envelopes or as an edge cut? Corrected in Rev 2.0 alpha 1: Properly assign potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.5mm UFBGA-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8.

New Pull Request

Labels Milestones