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BackMac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 0 Minor layout tweaks Finish schematic, add PDF | J6 | 1 | B10k | \*\*Potentiometer, 16 mm vertical board mount OR: | | L1 | 1 | TL074 | Quad operational amplifier, DIP-14
- -5.038511e-001 8.637905e-001 0.000000e+000 vertex 8.646397e+000 4.992001e+000.
- Hole Samtec HPM power header series 3.81mm post.
- 0900FM15K0039 DFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf.