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Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

• (end 4.5 -4.4 (hatch full.
• (i) the power, direct.
• Pin-PCB-offset 9.4mm 9-pin D-Sub connector.
• Pins Mini-Pentode, 5-pin, e.g.
• Vertex -6.04355 -2.39281 19.9.

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