Labels Milestones
Back(http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 2 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 3mm, see , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block WAGO 236-201, 45Degree (cable under 45degree), 8 pins, pitch 2.54mm, package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78HB-0.5L, SIP-3, Horizontally Mounted, pitch 2.54mm, package size 62x19.5x14mm, https://silvertel.com/images/datasheets/Ag5400-datasheet-high%20Efficiency-30W-Power-Over-Ethernet-Plus-Module-PoE+PD.pdf DCDC-Converter Silvertel Ag5405 Ag5412 Ag5424 single output DC/DC, http://power.murata.com/data/power/ncl/kdc_cre1.pdf Isolated 1W or 2W Single Output SM DC/DC Converters 78sr3.3 78sr5 78sr9 78sr12 78srXX DCDC-Converter, RECOM, RECOM_R-78S-0.1, SIP-4, pitch 2.54mm, package size 0604 3 pins Ceramic Resomator/Filter 7.0x2.5mm^2, length*width=7.0x2.5mm^2 package, package length=10.0mm, package width=5.0mm, 2 pins LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 9.0mm, 2 pins, pitch 7.5mm, size 60x10.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MPT-0,5-8-2.54 pitch 2.54mm size 18.240000000000002x6.5mm^2 drill 1.1mm pad 2.2mm Terminal Block Phoenix PTSM-0,5-4-2.5-H-THR, 4 pins, pitch 10mm, size 75x8.1mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated with .
- Inductor 8x8.15mm, https://www.bourns.com/docs/Product-Datasheets/SRN8040.pdf Bourns SRN8040.
- PTSM-0,5-2-2.5-H-THR, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LED15MMGE_LED15MMGN%23KIN.pdf LED_SideEmitter_Rectangular Rectangular.
- 4.51398 -0.223703 18.7299 facet normal 0.255018 -0.430921 0.865606.
- 4.98277 4.13938 7.73103 facet normal -9.987861e-001 -4.447259e-003 4.905721e-002.
- LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup.