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BackCompare 19 commits » 33729ec97f More repo cleanup, adopt github .gitignore file 8976a63dc06fa25beedf8d2553931872c491047e adds README.md file again gets comfier with gitignore and git rm --cache corrects inexplicably begreebled lower thre knob labels; confirms mask color is as defined replaces FIREBALL mask/etch with silkscreen replaces FIREBALL mask/etch with silkscreen Add footprint items for panel holes; separate panel and pcb into different files Altech AK300 terminal block, pitch 5.08mm, size 35.6x8.45mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42819-52XX, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xx-DV-TE, 43 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Inductor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm SSOP, 8 Pin (http://www.fujitsu.com/ca/en/Images/MB85RS2MT-DS501-00023-1v0-E.pdf), generated with kicad-footprint-generator connector wire 0.5sqmm strain-relief Soldered wire connection, for 6 times 0.5 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 3.5mm.
- MSTBVA_2,5/11-G; number of pins: 06; pin.
- (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm.
- Copper Layer Stackup: .
- -4.690112e-15 1.000000e+00 facet normal 4.589969e-01.
- Vertex 8.09017 5.87785 0 facet normal 0.243829 0.187973.