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Back14.7x10mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix PT-1,5-15-5.0-H pitch 5mm size 10x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00080, 4 pins, pitch 10mm, size 12.3x14mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole horizontal IDC header THT 1x22 1.00mm single row Through hole angled pin header SMD 2x15 1.27mm double row surface-mounted straight pin header, 2x38, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x15 1.27mm single row style2 pin1 right Through hole angled pin header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole IDC header, 2x08, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x19 2.00mm double row Through hole socket strip THT 2x39 2.00mm double row Through hole angled socket strip SMD 2x27 1.27mm double row Through hole IDC header, 2x15, 1.27mm pitch, double rows Through hole angled socket strip, 2x28, 2.00mm pitch, single row Through hole.
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