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WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf DFN package size 1006 3 pins THT ceramic resonator filter DSS6 SMD Resomator/Filter Murata CDSCB, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD Resomator/Filter Murata SFECV, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 4.5x2.0mm^2 package SMD Crystal TXC 9HT11 http://txccrystal.com/images/pdf/9ht11.pdf, hand-soldering, 2.0x1.2mm^2 package SMD Crystal TXC 7M http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, 3.2x2.5mm^2 package crystal Epson Toyocom FA-238 https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, 3.2x2.5mm^2 package SMD SMT SPST EVQP2 0 4 2 Button_Switch_SMD SW_SPST_EVQP7C Light Touch Switch 0 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE28.pdf Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000C374.pdf SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch.

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