Labels Milestones
BackPackage SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 40 leads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62.
- Ublox ZED GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf.
- 3005, http://www.bourns.com/docs/Product-Datasheets/3005.pdf Potentiometer horizontal Bourns 3314S Potentiometer, vertical.
- MT series http://cdn-reichelt.de/documents/datenblatt/B400/MT.pdf, hand-soldering, 3.2x2.5mm^2 package crystal.
- SRN6028 SMD inductor Bourns.