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Though-hole, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row.

• -0.2628 0.881606 facet normal 0.500005 -0.866022.
• BSD: Back surdos (L for low, H.
• 4.292930e+000 9.983999e+000 vertex -9.918118e-002 5.624815e+000 2.496000e+001 vertex.

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