3
1
Back

Pin, exposed pad: 4.5x8.1mm, with thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.5mm; see section.

New Pull Request