3
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Mm Body, 2.00 mm Footprint [TQFP] thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator JST SH series connector, 53261-0771 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator JST PHD series connector, S12B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 (so is open or ground). Part of speed \nswitch mod (0 F.Cu signal hide (33 F.Adhes user (34 B.Paste user (35 F.Paste user (36 "B.SilkS" user "B.Silkscreen" (37 "F.SilkS" user "F.Silkscreen" (38 "B.Mask" user (39 "F.Mask" user (40 "Dwgs.User" user "User.Drawings" (41 "Cmts.User" user "User.Comments" 42 "Eco1.User" user "User.Eco1" 43 "Eco2.User" user "User.Eco2" (44 "Edge.Cuts" user (45 Margin user (46 "B.CrtYd" user "B.Courtyard" 47 "F.CrtYd" user "F.Courtyard" attr (teardrop (type padvia min_thickness 0.0254) (filled_areas_thickness no Binary files /dev/null and b/Images/IMG_6770.JPG differ Binary files a/3D Printing/AD&D 1e spell names in Filmoscope Quentin' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/FIREBALL VCO.png differ false XS3 FM CV From c852e5d6ad8630143a633f6c4ffcb4d705a43337 Mon Sep 17 00:00:00 2001 .../Panels/UNSEEN SERVANT.png | Bin 0 -> 16700 bytes .../SPIDER CLIMB.png | Bin 0 -> 16369.

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