3
1
Back

SPST KingTek_DSHP09TJ, Slide, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/6957fb.pdf#page=36), generated with kicad-footprint-generator Molex PicoBlade series connector, 502585-0970 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator JST XA series connector, 53398-1371 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 1 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2 mm² wires, basic insulation, conductor diameter.

New Pull Request