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User "F.Adhesive" (34 "B.Paste" user (35 F.Paste user hide (48 B.Fab user (49 F.Fab user (aux_axis_origin 0 0 Y N 2 F N DEF SW_3PDT_x3 SW 0 40 Y Y 1 F N DEF SW_SPDT SW 0 0 Y N 1 F P Hardware/Panel/precadsr-panel/precadsr-panel-rescue.kicad_sym Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/DIP-8_W7.62mm_Socket_LongPads.kicad_mod Normal file Unescape DEF Kosmo_panel_Ground_point_for_NPTH GP 0 40 Y Y 1 F N DEF SW_Push_Open SW 0 0 Y N 1 F N DEF SW_SPST SW 0 0 Sequencer based on EPCOS app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278), generated with kicad-footprint-generator Molex LY 20 series connector, B18B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-10DS-0.5V, 10 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 2mm, outer diameter 4.4mm.

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