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53398-1371 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 1x26, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x19, 1.27mm pitch, double rows Through hole angled pin header THT 1x27 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x18 2.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x29 2.54mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 14 pins, pitch 10mm, size 75x8.1mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-307, 45Degree (cable under 45degree), 24 pins, pitch 3.5mm, size 52.5x7.6mm^2, drill diamater 1.15mm, pad diameter.

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