synth_tools

Back

0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight socket strip, 1x14, 2.00mm pitch, double rows Through hole straight pin header, 2x20, 2.00mm pitch, double rows Surface mounted pin header THT 1x15 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x16 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x26 2.54mm double row Through hole straight socket strip, 1x16, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x36 1.27mm double row Through hole straight pin header, 2x35, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x17, 1.27mm pitch, double rows Through hole socket strip THT 2x33 1.27mm double row Through hole angled.

New Pull Request

Labels Milestones