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Back[TSSOP] with exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC header, 2x10, 1.27mm pitch, single row Through hole angled socket strip THT 2x16 2.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row style2 pin1 right Through hole angled pin header, 1x39, 1.00mm pitch, 2.0mm pin length, single row style2 pin1 right Through hole angled socket strip SMD 1x10 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 1x40, 2.54mm pitch, double rows Through hole angled pin header, 2x33, 1.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 2x07, 1.27mm pitch, single row style1 pin1 left.
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