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64800311622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator JST XA vertical JST EH series connector, S13B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 10.6, Wuerth electronics 9776050960 (https://katalog.we-online.com/em/datasheet/9776050960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 14-Lead Plastic Thin Shrink Small Outline (SM) - 5.28 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16), generated with kicad-footprint-generator Soldered wire connection, for 6 times 1 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, 14111013001xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13001XXX_100228421DRW046C.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.75 mm² wires, reinforced.

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