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FE Package; 16-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 40 leads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 5x-dip-switch SPST KingTek_DSHP05TJ, Slide, row spacing 15.24 mm (600 mils 32-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf.

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