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Mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 8.61 mm.

• -1.822821e-01 -1.015564e-03 vertex -1.044170e+02.
• B08B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with.

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