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Technologies BMI-S-101 Shielding Cabinet One Piece SMD 36.83x33.68mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-102 Shielding Cabinet SMD 20x20mm WE-SHC Shielding Cabinet THT 31x31mm WE-SHC Shielding Cabinet One Piece SMD 39.60x39.60mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-104 Shielding Cabinet Two Piece SMD 44.37x44.37mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies 97-2002 EZ PEEL Shielding Cabinet THT 21x21mm WE-SHC Shielding Cabinet One Piece SMD 38.10x25.40mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-230-F Shielding Cabinet THT 61x61mm Signal Relay, 10x6mm, 2 Form C, vertical mount, 6A, 5-60V, https://www.fujitsu.com/sg/imagesgig5/ftr-ly.pdf relay SPDT form c vertical Omron Relay, SPST, https://gfinder.findernet.com/assets/Series/355/S32EN.pdf Finder 32.21-x300 Relay, SPST, High Capacity, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT FRT5 narrow footprint Finder 32.21-x000 Relay, SPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron Relay SPDT, http://www.omron.com/ecb/products/pdf/en-g5le.pdf Relay SPDT Finder 40.11 Relay DPDT IM-relay FRT5 Kemet signal relay, DPDT, double coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT non single coil latching through hole 3.2mm, height 5.6, Wuerth electronics 9774010982 (https://katalog.we-online.de/em/datasheet/9774010982.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, through hole 2.7mm, height 2, Wuerth electronics 97730356332 (https://katalog.we-online.com/em/datasheet/97730356332.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.5 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FF0829SA1, 29 Circuits (https://www.molex.com/pdm_docs/sd/2005280290_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xx-DV-PE-LC, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-BE-A, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST XH series connector, S5B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1510, with PCB cutout, light-direction upwards, see http://www.everlight.com/file/ProductFile/ITR8307.pdf refective opto couple photo coupler package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for diode bridges, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.65mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 676 1.

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