3
1
Back

(MS) [MSOP], variant of 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [QFN] with thermal vias; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster.

New Pull Request