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Thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL ZIF 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 7x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body with Exposed Pad Variation; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 8 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 3.2mm, no annular, M2.5, ISO7380 mounting hole 6.4mm no annular Mounting Hole 2.2mm, no annular, M4, ISO7380 mounting hole.

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